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STPS1L20M
LOW DROP POWER SCHOTTKY RECTIFIER
Table 1: Main Product Characteristics IF(AV) VRRM Tj (max) VF(max) FEATURES AND BENEFITS

1A 20 V 150C 0.37 V
A C
STmite (DO216-AA)
Very small conduction losses Negligible switching losses Extremely fast switching Low forward voltage drop for higher efficiency and extented battery life Low thermal resistance Avalanche capability specified
DESCRIPTION Single Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. Packaged in STmite, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. Due to the small size of the package this device fits battery powered equipment (cellular, notebook, PDA's, printers) as well chargers and PCMCIA cards. Table 3: Absolute Ratings (limiting values) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) RMS forward voltage IF(AV) IFSM PARM Tstg Tj dV/dt Average forward current Surge non repetitive forward current Repetitive peak avalanche power Storage temperature range
Table 2: Order Code Part Number STPS1L20M
Marking 1L2
Value 20 2 Tc = 140C = 0.5 10 ms sinusoidal tp = 1s Tj = 25C 1 50 1400 -65 to + 150 150 10000
Unit V A A A W C C V/s
Maximum operating junction temperature * Critical rate of rise of reverse voltage (rated VR, Tj = 25C)
1 dPtot * : --------------- > ------------------------- thermal runaway condition for a diode on its own heatsink dTj Rth ( j - a )
September 2004
REV. 3
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STPS1L20M
Table 4: Thermal Resistance Symbol Rth(j-c)* Junction to case Rth(j-l)* Junction to ambient Parameter Value 20 250 Unit C/W C/W
* Mounted with minimum recommended pad size, PC board FR4.
Table 5: Static Electrical Characteristics Symbol Parameter Tests conditions Tj = 25C Tj = 85C IR * Reverse leakage current Tj = 25C Tj = 85C Tj = 25C Tj = 85C Tj = 25C VF * Forward voltage drop Tj = 85C Tj = 25C Tj = 85C
Pulse test: * tp = 380 s, < 2%
Min.
Typ 0.015 0.9 0.005 0.45
Max. 0.075 4.5 0.035 2.5 0.025 1.6 0.43 0.37 0.53 0.49
Unit
VR = VRRM VR = 10V VR = 5V
mA
0.003 0.3
IF = 1A IF = 3A
0.38 0.32 0.46 0.42
2
V
To evaluate the conduction losses use the following equation: P = 0.34 x IF(AV) + 0.07 IF (RMS)
Figure 1: Conduction losses versus average current
PF(AV)(W)
0.50 0.45 0.40 0.35 0.30 0.25
= 0.05 =1 = 0.1 = 0.2 = 0.5
Figure 2: Average forward current versus ambient temperature ( = 0.5)
IF(AV)(A)
1.1
Rth(j-a)=Rth(j-c)
1.0 0.9 0.8 0.7 0.6 0.5
Rth(j-a)=270C/W
0.20 0.15 0.10 0.05 0.00 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
T
0.4 0.3 0.2
IF(AV)(A)
=tp/T
1.0 1.1
0.1
tp
Tamb(C)
0 25 50 75 100 125 150
0.0
1.2
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STPS1L20M
Figure 3: Normalized avalanche derating versus pulse duration
PARM(tp) PARM(1s)
1
power
Figure 4: Normalized avalanche derating versus junction temperature
PARM(tp) PARM(25C)
1.2 1
power
0.1
0.8 0.6
0.01
0.4 0.2
0.001 0.01 0.1 1
tp(s)
10 100 1000
Tj(C)
0 25 50 75 100 125 150
Figure 5: Non repetitive surge peak forward current versus overload duration (maximum values)
IM(A)
25
Figure 6: Relative variation of thermal impedance junction to ambient versus pulse duration
Zth(j-c)/Rth(j-c)
1.0 0.9
20
0.8 0.7
15
TC=25C
0.6 0.5
= 0.5
10
TC=75C
0.4 0.3
= 0.2 = 0.1 Single pulse
5
TC=125C
IM t
0.2 0.1
T
0 1.E-03
=0.5
t(s)
1.E-02 1.E-01 1.E+00
tp(s)
1.E-03 1.E-02
0.0 1.E-04
=tp/T
tp
1.E-01
Figure 7: Reverse leakage current versus reverse voltage applied (typical values)
IR(mA)
1.E+02
Tj=150C
Figure 8: Reverse leakage current versus junction temperature (typical values)
IR(mA)
1.E+02
VR=20V
1.E+01
Tj=125C
1.E+01
Tj=100C
1.E+00
Tj=75C
1.E+00
1.E-01
Tj=50C
1.E-01
1.E-02
Tj=25C
1.E-02
VR(V)
1.E-03 0 2 4 6 8 10 12 14 16 18 20
Tj(C)
1.E-03 0 25 50 75 100 125 150
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STPS1L20M
Figure 9: Junction capacitance versus reverse voltage applied (typical values)
C(pF)
1000
F=1MHz VOSC=30mVRMS Tj=25C
Figure 10: Forward voltage drop versus forward current
IFM(A)
2.0 1.8 1.6 1.4 1.2
Tj=85C (typical values) Tj=85C (maximum values)
100
1.0 0.8 0.6 0.4
Tj=25C (maximum values)
VR(V)
10 1 10 100
0.2 0.0 0.00
VFM(V)
0.05 0.10 0.15 0.20 0.25 0.30 0.35
0.40
0.45
0.50
Figure 11: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35m, typical values)
Rth(j-a)(C/W)
250
200
150
100
50
0 0 20 40 60 80
S(mm)
100 120 140 160 180 200
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STPS1L20M
Figure 12: STmite Package Mechanical Data DIMENSIONS REF. Millimeters Inches Min. Typ. Max. Min. Typ. A 0.85 1.00 1.15 0.033 0.039 A1 -0.05 0.05 -0.002 b 0.40 0.65 0.016 b2 0.70 1.00 0.027 c 0.10 0.25 0.004 D 1.75 1.90 2.05 0.069 0.007 E 1.75 1.90 2.05 0.069 0.007 H 3.60 3.75 3.90 0.142 0.148 L 0.50 0.63 0.80 0.020 0.025 L2 1.20 1.35 1.50 0.047 0.053 L3 0.50 0.019 ref ref R 0.07 0.003 R1 0.07 0.003
L3 D
b2
b
H L2 L R E
C A1 R1 0 to 6
A
Max. 0.045 0.002 0.025 0.039 0.010 0.081 0.081 0.154 0.031 0.059
Figure 13: Foot Print Dimensions (in millimeters)
1.82 1.38
2.03
1.10
0.75
0.50
0.71
Table 6: Ordering Information Ordering type STPS1L20M Marking 1L2 Package STmite Weight 15.5 mg Base qty 12000 Delivery mode Tape & reel
Table 7: Revision History Date Jul-2003 13-Sep-2004 Revision 2A 3 Last update. STmite package dimensions reference A1 change: from blank (min) to -0.05mm and from 0.10 (max) to 0.05mm. Description of Changes
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STPS1L20M
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
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